Wheels for Wafer Back Grinding

Our Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Our Special advanced porosity technology makes it possible to grind all types of wafer with less bug-surface damage. Our Back-Grinding wheels use a special vitrified bond for rough grinding or resin bond for fine finishing improved process accuracy. Our back- grinding wheel features free cutting, excellent wear resistance, and suitable shape for maintainability and durability.