Ongoing technological advances in Semiconductors and electronic components rise a succession of new materials. As a result, We have developed new precision diamond tools for these materials.
SP Precision diamond wheels have been widely used in cutting, slotting, dicing, back-thinning and other precision processing in semiconductor industry.
1. Dicing Blade with Hub
Our diamond blade with Hub is with a stronger edge, which makes the blade more rigid and better prevent a broken edge. Therefore, the cutting with the blade is highly efficient. This wheel is mainly used for the cutting and dicing of wafers, type, silicon, gaas, gap, lita0%, pzt, etc.
2. Dicing Blade without Hub
Dicing Blade without Hub is a kind of ultra thin and precision diamond blade with excellent cutting ability, rigidity and high efficiency. It fits to be used for dicing and slitting of materials, such as semiconductors, electronic components, ceramic, etc.
